DocumentCode :
2679910
Title :
Conformal copper deposition in deep trenches
Author :
Bollmann, D. ; Merkel, R. ; Klumpp, A.
Author_Institution :
Institut fur Festkopertechnologie
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
20
Lastpage :
22
Keywords :
Chemical vapor deposition; Conductivity; Copper; Filling; Integrated circuit interconnections; Integrated circuit technology; Metallization; Substrates; Temperature; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887497
Filename :
887497
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2679910
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