Title :
Influence of carrier gas on cu nucleation, film properties and MOCVD reaction kinetics
Author :
Röber, J. ; Riedel, S. ; Schulz, S.E. ; Gebner, T.
Author_Institution :
TU Chemmitz-Zwickau
Keywords :
Additives; Argon; Conductivity; Copper; Hydrogen; Kinetic theory; MOCVD; Metallization; Substrates; Temperature;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887499
