Deposition of barrier layer and CVD copper under no exposed wafer conditions : adhesion performance and process integration

Author

Braeckelmann, G. ; Manger, D. ; Seo, S.C. ; Beasor, S. ; Nifsten, S. ; Kaloyeros, A.E.

Author_Institution

The University at Albany

fYear

1997

fDate

16-19 March 1997

Firstpage

Lastpage

Keywords

Adhesives; Chemical vapor deposition; Conductivity; Copper; Filling; Inorganic materials; Metallization; Plasma measurements; Sputtering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

DOI

10.1109/MAM.1998.887500

Filename

887500

Link To Document