DocumentCode
267996
Title
Gallium-based liquid metal inkjet printing
Author
Daeyoung Kim ; Jun Hyeon Yoo ; Yunho Lee ; Wonjae Choi ; Koangki Yoo ; Jeong-Bong Lee
Author_Institution
Dept. of Electr. Eng., Univ. of Texas at Dallas, Dallas, TX, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
967
Lastpage
970
Abstract
We report clog-free and oxide-free metal inkjet printing applicable to flexible electronics using gallium-based liquid metal alloy. Inkjet printing has been developed and expanded to make a pattern of either non-conductive or conductive materials. In order to print typical conductive material, it utilizes metal nanoparticle dispersed in solvent or melts the metal. However, those methods often encounters clogging and oxidation problem. We fabricated a simple polydimethylsiloxane (PDMS) based inkjet printer incorporated with hydrochloric acid (HCl)-impregnated paper as orifice material. A constant stream of gallium-based liquid metal alloy droplet was demonstrated using the inkjet printer. Depending on the applied flow rate, pinch off and Rayleigh instability phenomena were observed. We printed beads-on-string shape gallium-based liquid metal alloy line on various flexible substrates such as Si wafer, PDMS, and a paper. Finally, it was demonstrated that the inkjet-printed gallium-based liquid metal can maintain its line shape without disconnection even with the significant deformation of a flexible paper.
Keywords
Rayleigh scattering; flexible electronics; gallium alloys; ink jet printing; liquid metals; nanoparticles; oxidation; polymers; PDMS; Rayleigh instability; clog-free metal inkjet printing; flexible electronics; flexible substrates; gallium-based liquid metal alloy; hydrochloric acid; impregnated paper; inkjet printer; metal nanoparticle; nonconductive materials; orifice material; oxidation problem; oxide-free metal inkjet printing; polydimethylsiloxane; Liquids; Metals; Orifices; Printers; Printing; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765804
Filename
6765804
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