DocumentCode :
2679991
Title :
Copper CMP evaluation: slurry chemical effect on planarization
Author :
Romagna, F. ; Fayolle, M.
Author_Institution :
GRESSI/CNET- France-Telecom
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
32
Lastpage :
35
Keywords :
Chemical industry; Circuits; Copper; Etching; Inorganic materials; Metallization; Metals industry; Planarization; Slurries; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887502
Filename :
887502
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2679991
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