A polymeric micro actuator to be integrated into an organic material based lab on chip microsystem

Author

Lefevre, F. ; Izquierdo, R. ; Schougaard, S.B.

Author_Institution

Resmiq & Dept. of Comput. Sci., Univ. du Quebec a Montreal, Montreal, QC

fYear

2008

fDate

22-25 June 2008

Firstpage

318

Lastpage

322

Abstract

The manufacturing of a microvalve actuated by the electroactive polymer polypyrrole has been investigated. The actuator uses the electrochemically induced out-of-plane strain of the polypyrrole/NaDBS (sodium dodecylbenzene sulfonate) system. The manufacturing process of the all polymer (microfluidic channels and actuator) device has been optimized. Deposition of PPY on gold electrodes was achieved even if there is no chemical link between gold and the polymer. Delamination at the gold/PPY interface was observed after the first cycle of actuation. The use of a different electrode material to enable a chemical link between the electrode and the polymer is proposed. This type of micro actuator can easily be integrated in an all organic microsystem. It can also be assembled in series to form an integrated micropump for a disposable device.

Keywords

bioMEMS; biomedical electrodes; conducting polymers; delamination; lab-on-a-chip; manufacturing processes; microactuators; microchannel flow; microelectrodes; micropumps; microvalves; delamination; disposable device; electroactive polymer polypyrrole; electrochemically induced out-of-plane strain; electrode material; gold electrode; integrated micropump; lab-on-chip microsystem; manufacturing process; microfluidic channel; microvalve actuator; organic material; organic microsystem; polymeric microactuator; polypyrrole-NaDBS system; sodium dodecylbenzene sulfonate system; Actuators; Capacitive sensors; Chemicals; Electrodes; Gold; Manufacturing; Microactuators; Microvalves; Organic materials; Polymers;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on

Conference_Location

Montreal, QC

Print_ISBN

978-1-4244-2331-6

Electronic_ISBN

978-1-4244-2332-3

Type

conf

DOI

10.1109/NEWCAS.2008.4606385

Filename

4606385