DocumentCode
2680006
Title
Multilevel interconnection technologies and future requirements for logic applications
Author
Brillouët, M.
Author_Institution
France Telecom CNET
fYear
1997
fDate
16-19 March 1997
Firstpage
36
Lastpage
39
Keywords
Atherosclerosis; Dielectric constant; Dielectric materials; Logic; Materials reliability; Parasitic capacitance; Plugs; Power system interconnection; Telecommunications; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887503
Filename
887503
Link To Document