DocumentCode :
2680064
Title :
Investigation of copper diffusion in SiOF, TEOS oxide and TCA oxide using bias thermal stress (BTS) tests
Author :
Abdul-Hak, A. ; Ahrens, C. ; Hasse, W. ; Ullmann, J.
Author_Institution :
Universitat Hannover
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
47
Lastpage :
49
Keywords :
Circuit testing; Copper; Dielectric materials; Inorganic materials; Integrated circuit testing; Materials testing; Metallization; Performance evaluation; Thermal stresses; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887507
Filename :
887507
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680064
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