• DocumentCode
    2680064
  • Title

    Investigation of copper diffusion in SiOF, TEOS oxide and TCA oxide using bias thermal stress (BTS) tests

  • Author

    Abdul-Hak, A. ; Ahrens, C. ; Hasse, W. ; Ullmann, J.

  • Author_Institution
    Universitat Hannover
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    47
  • Lastpage
    49
  • Keywords
    Circuit testing; Copper; Dielectric materials; Inorganic materials; Integrated circuit testing; Materials testing; Metallization; Performance evaluation; Thermal stresses; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1998.887507
  • Filename
    887507
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2680064