DocumentCode

2680084

Title

Issues for multilevel metallization in high density circuits

Author

Joswig, H.

Author_Institution

SIEMENS AG

fYear

1997

fDate

16-19 March 1997

Firstpage

50

Lastpage

50

Keywords

Dielectric films; Inorganic materials; Integrated circuit interconnections; Lithography; Metallization; Modems; Planarization; Production; Thick film circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887508

Filename

887508