DocumentCode :
2680084
Title :
Issues for multilevel metallization in high density circuits
Author :
Joswig, H.
Author_Institution :
SIEMENS AG
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
50
Lastpage :
50
Keywords :
Dielectric films; Inorganic materials; Integrated circuit interconnections; Lithography; Metallization; Modems; Planarization; Production; Thick film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887508
Filename :
887508
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680084
