DocumentCode :
2680092
Title :
Dielectric barriers for cu metallization systems
Author :
Vogt, M. ; Kachel, M. ; Drescher, K.
Author_Institution :
TU Dresden, Institut fur Halbleiter- und Mikrosystemtechnik
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
51
Lastpage :
52
Keywords :
Copper; Dielectric materials; Dielectric measurements; Inorganic materials; Metallization; Optical films; Plasma measurements; Silicon compounds; Thermal stresses; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887509
Filename :
887509
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680092
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