DocumentCode
2680092
Title
Dielectric barriers for cu metallization systems
Author
Vogt, M. ; Kachel, M. ; Drescher, K.
Author_Institution
TU Dresden, Institut fur Halbleiter- und Mikrosystemtechnik
fYear
1997
fDate
16-19 March 1997
Firstpage
51
Lastpage
52
Keywords
Copper; Dielectric materials; Dielectric measurements; Inorganic materials; Metallization; Optical films; Plasma measurements; Silicon compounds; Thermal stresses; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887509
Filename
887509
Link To Document