Title :
Polymers for high performance interconnects
Author :
Taylor, K.J. ; Jong, S.-P. ; Eissa, M. ; Gaynor, J. ; Nguyen, H.
Author_Institution :
Texas Instruments, Inc.
Keywords :
Capacitance; Dielectric devices; Dielectric losses; Dielectric materials; Fabrication; Inorganic materials; Metallization; Permittivity; Polymers; Thermal stability;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887513
