DocumentCode
2680146
Title
Polymers for high performance interconnects
Author
Taylor, K.J. ; Jong, S.-P. ; Eissa, M. ; Gaynor, J. ; Nguyen, H.
Author_Institution
Texas Instruments, Inc.
fYear
1997
fDate
16-19 March 1997
Firstpage
59
Lastpage
63
Keywords
Capacitance; Dielectric devices; Dielectric losses; Dielectric materials; Fabrication; Inorganic materials; Metallization; Permittivity; Polymers; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887513
Filename
887513
Link To Document