DocumentCode

2680264

Title

W CMP process integration

Author

Sicurani, E. ; Fayolle, M. ; Gobil, Y. ; Morand, Y.

Author_Institution

SGS Thomson R&D division

fYear

1997

fDate

16-19 March 1997

Firstpage

86

Lastpage

87

Keywords

Etching; Geometry; Inorganic materials; Metallization; Plugs; Research and development; Semiconductor films; Slurries; Temperature; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887521

Filename

887521