DocumentCode
2680299
Title
Advanced materials for interconnections of the future - need and strategy
Author
Murarka, S.P.
Author_Institution
SRC Center for Advanced Interconnect Science and Technology
fYear
1997
fDate
16-19 March 1997
Firstpage
93
Lastpage
93
Keywords
Costs; Inorganic materials; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit technology; Lead compounds; Materials science and technology; Metallization; Semiconductor device manufacture; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887524
Filename
887524
Link To Document