DocumentCode
2680317
Title
Dry etch challenges of 0.25 /spl mu/m dual damascene structures
Author
Schnabel, R.F. ; Dobuzinski, D. ; Wang, F. ; Perng, D.C. ; Gambino, J. ; Palm, H.
Author_Institution
Siemens
fYear
1997
fDate
16-19 March 1997
Firstpage
102
Lastpage
104
Keywords
Dry etching; Inorganic materials; Integrated circuit interconnections; LAN interconnection; Lithography; Metallization; Random access memory; Resists; Sputter etching; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887526
Filename
887526
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