Title :
Capillary effect based TSV filling method
Author :
Jiebin Gu ; Xiang Jiang ; Heng Yang ; Xinxin Li
Author_Institution :
Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Abstract :
Via-filling is a critical and costly process of TSV fabrication and is usually realized by Cu-plating, CVD, etc. Liquid metal via-filling made by pressing solder from a melting solder pool into via holes faces problems of wafer breakage caused by pressure differential and cutting off solder-vias from the pool. A liquid bridge pinch-off effect based cutting-off method, together with a `wafer sandwich´ structure, has the feasibility to solve the above problems faced by the pressure assisted liquid metal via-filling approach.
Keywords :
liquid metals; solders; three-dimensional integrated circuits; CVD; TSV fabrication; capillary effect-based TSV filling method; copper plating; liquid bridge pinch-off effect-based cutting-off method; liquid metal via-filling; melting solder pool; pressure differential; pressure-assisted liquid metal via-filling approach; solder-vias; via holes; wafer breakage; wafer sandwich structure; Bridge circuits; Bridges; Filling; Liquids; Metals; Surface treatment; Through-silicon vias;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
DOI :
10.1109/MEMSYS.2014.6765841
