DocumentCode :
2680324
Title :
Reliability-oriented broadcast electrode-addressing for pin-constrained digital microfluidic biochips
Author :
Huang, Tsung-Wei ; Ho, Tsung-Yi ; Chakrabarty, Krishnendu
Author_Institution :
Dept. of Comput. Sci. & Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2011
fDate :
7-10 Nov. 2011
Firstpage :
448
Lastpage :
455
Abstract :
Designs for pin-constrained digital microfluidic biochips (PDMFBs) are receiving much attention because they simplify chip fabrication and packaging, and reduce product cost. To reduce the pin count, broadcast addressing, by minimally grouping electrode sets with non-conflict signal merging, has emerged as a promising solution. Nevertheless, naive signal merging has the potential to cause excessive electrode actuations, which has been reported to have direct and adverse effect on chip reliability. According to recent studies, reliability is an important attribute for PDMFBs particularly developed for medical applications as it directly affects the final medical decision making. However, no research findings have been reported on the reliability problem in pin-constrained designs. To make PDMFBs more feasible for practical applications, we propose in this paper the first matching-based reliability-oriented broadcast-addressing algorithm for PDMFBs. We identify the factors that affect reliability and incorporate into the design-technique attributes that enhance reliability. Experimental results demonstrate the effectiveness of the proposed algorithm.
Keywords :
decision making; electronics packaging; lab-on-a-chip; microelectrodes; microfabrication; microfluidics; reliability; chip fabrication; chip reliability; grouping electrode sets; matching-based reliability-oriented broadcast-addressing algorithm; medical decision making; pin-constrained designs; pin-constrained digital microfluidic biochips; Algorithm design and analysis; Electrodes; Force; Grounding; Pins; Reliability engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
978-1-4577-1399-6
Electronic_ISBN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2011.6105367
Filename :
6105367
Link To Document :
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