DocumentCode :
2680337
Title :
Total process of 0.18 and 0.25 /spl mu/m ohmic contacts
Author :
Hara, T.
Author_Institution :
Hosei University
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
108
Lastpage :
109
Keywords :
Collimators; Contact resistance; Inorganic materials; Metallization; Ohmic contacts; Semiconductor device modeling; Silicidation; Surface resistance; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887529
Filename :
887529
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680337
