From chips to dust: The MEMS shatter secure chip

Author

Banerjee, Nabaneeta ; Xie, Yingtao ; Rahman, Md Mamunur ; Kim, Heonhwan ; Mastrangelo, Carlos H.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA

fYear

2014

fDate

26-30 Jan. 2014

Firstpage

1123

Lastpage

1126

Abstract

This paper presents the implementation of a transience mechanism for silicon microchips via low-temperature postprocessing steps that transform almost any electronic, optical or MEMS substrate chips into transient ones. Transience is achieved without any hazardous or explosive materials. Triggered chip transience is achieved by the incorporation of a distributed, thermally-activated expanding material on the chip backside. When heated at 160°C the expanding material produces massive chip cleavage mechanically shattering the chip into a heap of silicon dust.

Keywords

dust; elemental semiconductors; micromechanical devices; microprocessor chips; silicon; MEMS substrate; Si; chip backside; chip cleavage; electronic substrate; low-temperature postprocessing; optical substrate; silicon dust; silicon microchips; temperature 160 degC; thermally-activated expanding material; triggered chip transience; Polymers; Silicon; Stress; Substrates; Thermal expansion; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/MEMSYS.2014.6765843

Filename

6765843