DocumentCode
2680362
Title
Trends in complex SoC design: From technology variability to multiprocessor architectures
Author
Lequepeys, Jean-Rene
Author_Institution
Head of ASIC Design Department, LETI-CEA, France
fYear
2008
fDate
22-25 June 2008
Abstract
Emerging 3D stacking techniques combined with the scaling of CMOS technologies give to the SoC architects the possibility of designing very complex multi-application systems. New parallel architectures are proposed to bring flexibility and facilitate the management of the complexity, but the new challenge that the architects have to address, concurrently with the power saving policies, is the technology variability which becomes more and more important in advanced technologies. At system level, the architecture has to take this limitation into account, to reach the better performance the technology could provide.
Keywords
Application specific integrated circuits; BiCMOS integrated circuits; CMOS image sensors; CMOS technology; Energy management; Head; Parallel architectures; Power system management; Stacking; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
Conference_Location
Montreal, QC, Canada
Print_ISBN
978-1-4244-2331-6
Electronic_ISBN
978-1-4244-2332-3
Type
conf
DOI
10.1109/NEWCAS.2008.4606406
Filename
4606406
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