• DocumentCode
    2680362
  • Title

    Trends in complex SoC design: From technology variability to multiprocessor architectures

  • Author

    Lequepeys, Jean-Rene

  • Author_Institution
    Head of ASIC Design Department, LETI-CEA, France
  • fYear
    2008
  • fDate
    22-25 June 2008
  • Abstract
    Emerging 3D stacking techniques combined with the scaling of CMOS technologies give to the SoC architects the possibility of designing very complex multi-application systems. New parallel architectures are proposed to bring flexibility and facilitate the management of the complexity, but the new challenge that the architects have to address, concurrently with the power saving policies, is the technology variability which becomes more and more important in advanced technologies. At system level, the architecture has to take this limitation into account, to reach the better performance the technology could provide.
  • Keywords
    Application specific integrated circuits; BiCMOS integrated circuits; CMOS image sensors; CMOS technology; Energy management; Head; Parallel architectures; Power system management; Stacking; Technology management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
  • Conference_Location
    Montreal, QC, Canada
  • Print_ISBN
    978-1-4244-2331-6
  • Electronic_ISBN
    978-1-4244-2332-3
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2008.4606406
  • Filename
    4606406