Title :
R.F. magnetron sputtered WTi and WTi-N thin films as diffusion barriers between Cu and Si
Author :
Ramarotafika, H. ; Lempérière, G.
Author_Institution :
Laboratoire des Plasmas et des Couches Minces - IMN
Keywords :
Argon; Backscatter; Copper; Inorganic materials; Rapid thermal annealing; Semiconductor films; Semiconductor thin films; Sputtering; Substrates; Tin;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887536
