DocumentCode

2680468

Title

Titanium monophosphide (TIP) layers as diffusion barriers

Author

Leutenecker, R. ; Froschle, B. ; Ramm, P.

Author_Institution

Fraunhofer-Institute for Solid State Technology

fYear

1997

fDate

16-19 March 1997

Firstpage

124

Lastpage

124

Keywords

Circuit testing; Coatings; Hydrogen; Rapid thermal annealing; Rapid thermal processing; Solid state circuits; Sputtering; Temperature; Tin; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887537

Filename

887537