DocumentCode :
2680477
Title :
Ultra trace analysis and electrical characterization of Cu diffusion through thin quasi-amorphous Ta-N-O barriers
Author :
Stavrev, M. ; Fischer, D. ; Wenzel, C. ; Heiser, T.
Author_Institution :
Dresden University of Technology
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
125
Lastpage :
126
Keywords :
Contacts; Electric resistance; Electromigration; Grain boundaries; Inorganic materials; Laboratories; Metallization; Optical films; Protection; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887539
Filename :
887539
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680477
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