Title :
TiN/W double layers as a barrier system for use in Cu metalization
Author :
Baumann, Joerg ; Markert, M. ; Werner, T. ; Rennau, Michael ; Kaufmann, Ch. ; Gebner, T.
Author_Institution :
Universitat Chemnitz-Zwickau
Keywords :
Adhesives; Annealing; Copper; Electric resistance; Electromigration; Integrated circuit interconnections; Metallization; Optical films; Optical microscopy; Tin;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887541