DocumentCode
2680652
Title
Stress in copper films for interconnects
Author
Riedel, S. ; Röber, J. ; Schulz, S.E. ; Gebner, T.
Author_Institution
Technische Universitat Chemnitz-Zwickau
fYear
1997
fDate
16-19 March 1997
Firstpage
148
Lastpage
149
Keywords
Copper; Electric resistance; Inorganic materials; Integrated circuit interconnections; Internal stresses; Metallization; Stress measurement; Temperature measurement; Tensile stress; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887551
Filename
887551
Link To Document