DocumentCode
2680664
Title
Influence of process parameters on chemical-mechanical polishing of copper
Author
Stavreva, Z. ; Zeidler, D. ; Plotner, M. ; Drescher, K.
Author_Institution
Dresden University of Technology
fYear
1997
fDate
16-19 March 1997
Firstpage
150
Lastpage
151
Keywords
Chemical processes; Chemical technology; Copper; Inorganic materials; Integrated circuit interconnections; Metallization; Planarization; Rough surfaces; Surface roughness; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887552
Filename
887552
Link To Document