DocumentCode :
2680664
Title :
Influence of process parameters on chemical-mechanical polishing of copper
Author :
Stavreva, Z. ; Zeidler, D. ; Plotner, M. ; Drescher, K.
Author_Institution :
Dresden University of Technology
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
150
Lastpage :
151
Keywords :
Chemical processes; Chemical technology; Copper; Inorganic materials; Integrated circuit interconnections; Metallization; Planarization; Rough surfaces; Surface roughness; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887552
Filename :
887552
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680664
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