• DocumentCode
    268068
  • Title

    Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators

  • Author

    Cheng Tu ; Lee, J.E.-Y.

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    1257
  • Lastpage
    1260
  • Abstract
    This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators.
  • Keywords
    Q-factor; elemental semiconductors; etching; finite element analysis; micromechanical resonators; silicon; etch hole assisted energy dispersion; finite element simulations; piezoelectric aluminum nitride contour mode resonators; quality factor; silicon bulk acoustic resonators; strain energy field; width extensional mode; Erbium; Iron; Mathematical model; Micromechanical devices; Q measurement; Resonant frequency; Strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765877
  • Filename
    6765877