DocumentCode
268068
Title
Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators
Author
Cheng Tu ; Lee, J.E.-Y.
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
1257
Lastpage
1260
Abstract
This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators.
Keywords
Q-factor; elemental semiconductors; etching; finite element analysis; micromechanical resonators; silicon; etch hole assisted energy dispersion; finite element simulations; piezoelectric aluminum nitride contour mode resonators; quality factor; silicon bulk acoustic resonators; strain energy field; width extensional mode; Erbium; Iron; Mathematical model; Micromechanical devices; Q measurement; Resonant frequency; Strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765877
Filename
6765877
Link To Document