DocumentCode :
268068
Title :
Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators
Author :
Cheng Tu ; Lee, J.E.-Y.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
1257
Lastpage :
1260
Abstract :
This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators.
Keywords :
Q-factor; elemental semiconductors; etching; finite element analysis; micromechanical resonators; silicon; etch hole assisted energy dispersion; finite element simulations; piezoelectric aluminum nitride contour mode resonators; quality factor; silicon bulk acoustic resonators; strain energy field; width extensional mode; Erbium; Iron; Mathematical model; Micromechanical devices; Q measurement; Resonant frequency; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765877
Filename :
6765877
Link To Document :
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