DocumentCode :
2681178
Title :
Three dimensional metallization for vertically integrated circuits
Author :
Bollmann, D. ; Braun, R. ; Buchner, R. ; Cao-Minh, U. ; Engelhardt, M. ; Errmann, G. ; Grabl, T. ; Hieber, K. ; Hübner, H. ; Kawala, G. ; Kleiner, M. ; Klumpp, A. ; Kühn, S. ; Landesberger, C. ; Lezec, H. ; Muth, W. ; Pamler, W. ; Popp, R. ; Renner, E. ;
Author_Institution :
Siemens AG Corporate Technology, Microelectronics
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
94
Lastpage :
98
Keywords :
Copper; Europe; Fabrication; Inorganic materials; Integrated circuit metallization; Integrated circuit technology; Microelectronics; Solid state circuits; Wafer bonding; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887612
Filename :
887612
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2681178
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