DocumentCode
268120
Title
Al-Foil on Encapsulant for the Interconnection of Al-Metalized Silicon Solar Cells
Author
Schulte-Huxel, H. ; Blankemeyer, S. ; Bock, R. ; Merkle, A. ; Kajari-Schröder, S. ; Brendel, R.
Author_Institution
Inst. for Solar Energy Res. Hamelin, Emmerthal, Germany
Volume
3
Issue
1
fYear
2013
fDate
Jan. 2013
Firstpage
77
Lastpage
82
Abstract
We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρc = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage Voc verify a damage- and loss-free interconnection which is supported by electroluminescence measurements.
Keywords
aluminium; contact resistance; electrical contacts; electrical resistivity; electroluminescence; elemental semiconductors; encapsulation; interconnections; internal stresses; laser beam welding; laser materials processing; semiconductor device metallisation; silicon; solar cells; tensile testing; Al; Al-metalized silicon solar cells; Si; accelerated aging; aluminum foil; aluminum-based AMELI process; contact resistance; conversion efficiency; damage-free interconnection; electrical contact resistivity; electrical laser interconnection; electroluminescence measurements; evaporated aluminum back contacts; fill factor; laser weld spots; loss-free interconnection; mechanical laser interconnection; mechanical stresses; n-type back-junction back-contact solar cells; open circuit voltage; perpendicular direction; proof-of-concept module; silicon solar cell interconnection; silicone encapsulant; single laser pulses; tear-off stresses; tensile testing machine; Electrical resistance measurement; Glass; Lamination; Lasers; Measurement by laser beam; Photovoltaic cells; Welding; Al-metallization; back-contact solar cells; laser microwelding; lead-free; module-level inter-connection; photovoltaic module;
fLanguage
English
Journal_Title
Photovoltaics, IEEE Journal of
Publisher
ieee
ISSN
2156-3381
Type
jour
DOI
10.1109/JPHOTOV.2012.2208096
Filename
6264076
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