DocumentCode :
2682324
Title :
Processing technology of embedded thin-film resistor materials
Author :
Lai, Lifei ; Sun, Rong ; Zhao, Tao ; Zeng, XiaoLiang ; Yu, ShuHui
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
60
Lastpage :
65
Abstract :
It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.
Keywords :
chromium; nickel; thermal stability; thin film resistors; ETFR material; Ni-Cr; embedded thin-film resistor material; microscopic characteristic; processing technology; thermal stability; Films; Metals; Resistance; Resistors; Sputtering; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105671
Filename :
6105671
Link To Document :
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