Title :
Photonic packaging using laser/receiver arrays and flexible optical circuits
Author :
Grimes, Gary J. ; Markush, J.P.C. ; Wong, Y.M. ; Anthony, P.J. ; Holland, W.R. ; Priest, E.G. ; Sherman, C.J. ; Peck, S.R. ; Muehlner, D.J. ; Faudskar, C.C. ; Nyquist, J.S. ; Helton, J.S. ; Sonnier, G.L. ; Gates, J.V. ; Honea, W.K. ; Bortolini, J.R.
Author_Institution :
Alabama Univ., Birmingham, AL, USA
Abstract :
The topic of this paper is a description of how we replaced the discrete optoelectronic and passive optics devices of the optical interconnection system of a DAGS VI-2000 with parallel optical components developed by the OETC. We have demonstrated that the use of parallel optics components, including high density laser transmitters, high density receivers and high density multifiber backplane connectors are compatible with standard electronic packaging technologies for large telecommunications platforms. We have further demonstrated that the use of parallel optics can dramatically increase system capacity with minimal impact on system physical architecture
Keywords :
arrays; optical interconnections; optical receivers; packaging; semiconductor laser arrays; DAGS VI-2000; OETC; flexible optical circuit; laser transmitter array; multifiber backplane connector; optical interconnection; optoelectronic device; parallel optical components; passive optics; photonic packaging; receiver array; telecommunications platform; Backplanes; Connectors; Laser theory; Optical arrays; Optical devices; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Telecommunication standards;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517435
