Photonic packaging using laser/receiver arrays and flexible optical circuits

Author

Grimes, Gary J. ; Markush, J.P.C. ; Wong, Y.M. ; Anthony, P.J. ; Holland, W.R. ; Priest, E.G. ; Sherman, C.J. ; Peck, S.R. ; Muehlner, D.J. ; Faudskar, C.C. ; Nyquist, J.S. ; Helton, J.S. ; Sonnier, G.L. ; Gates, J.V. ; Honea, W.K. ; Bortolini, J.R.

Author_Institution

Alabama Univ., Birmingham, AL, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

500

Lastpage

505

Abstract

The topic of this paper is a description of how we replaced the discrete optoelectronic and passive optics devices of the optical interconnection system of a DAGS VI-2000 with parallel optical components developed by the OETC. We have demonstrated that the use of parallel optics components, including high density laser transmitters, high density receivers and high density multifiber backplane connectors are compatible with standard electronic packaging technologies for large telecommunications platforms. We have further demonstrated that the use of parallel optics can dramatically increase system capacity with minimal impact on system physical architecture

Keywords

arrays; optical interconnections; optical receivers; packaging; semiconductor laser arrays; DAGS VI-2000; OETC; flexible optical circuit; laser transmitter array; multifiber backplane connector; optical interconnection; optoelectronic device; parallel optical components; passive optics; photonic packaging; receiver array; telecommunications platform; Backplanes; Connectors; Laser theory; Optical arrays; Optical devices; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Telecommunication standards;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517435

Filename

517435