Title :
Failure analysis of LEDs
Author :
Guoguang, Lu ; Shaohua, Yang ; Zhifeng, Lei
Author_Institution :
Applic. of Electron. Component Lab., Sci. & Technol. on Reliability Phys, Guangzhou, China
Abstract :
Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding defects, die attaching defects and other defects that caused by poor package process are investigated through some failure analysis cases.
Keywords :
electronics packaging; failure analysis; light emitting diodes; reliability; LED reliability; bonding defects; die attaching defects; failure analysis; illumination applications; light-emitting diodes; packaging process; Bonding; Failure analysis; Light emitting diodes; Materials; Microassembly; Packaging; Reliability;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105673
