Study on thermal conductive adhesives for high-power LEDs packaging

Author

Chen, Mingxiang ; Xu, Tianming ; Liu, Sheng ; Wong, C.P.

Author_Institution

Sch. of Mech. Sci. & Engin, Huazhong Univ. of Sci. & Tech., Wuhan, China

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

104

Lastpage

108

Abstract

Direct bonded copper (DBC) as heat spreader and highly thermal conductive adhesives as thermal interface materials (TIMs), the light performances of packaged high-brightness light-emitting diodes (HB-LEDs) were tested. The results indicated that the light output power of LED modules increased with the thermal conductivities of TIMs. Apart from its low bulk thermal resistance, highly thermal conductive adhesive has high adhesion with adjacent substrates which resulted in low contact thermal resistance, then the optical performance and reliability of LED package can be improved.

Keywords

adhesives; electronics packaging; light emitting diodes; thermal conductivity; thermal resistance; DBC; HB-LED; LED modules; TIM; direct bonded copper; high-power LED packaging; light performances; packaged high-brightness light-emitting diodes; thermal conductive adhesive; thermal conductive adhesives; thermal interface materials; thermal resistance; Conductivity; Electronic packaging thermal management; Light emitting diodes; Packaging; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105681

Filename

6105681