DocumentCode :
2682945
Title :
Synthesis and low-temperature sintering of tin-doped silver nanoparticles
Author :
Zhang, Yujun ; Yu, Hui ; Li, Liangliang
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
209
Lastpage :
212
Abstract :
Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.
Keywords :
X-ray chemical analysis; X-ray diffraction; differential scanning calorimetry; electrical conductivity; nanofabrication; nanoparticles; scanning electron microscopy; silver; sintering; thermal conductivity; tin; Ag:Sn; DSC; EDS; SEM; TGA; XRD; electrical conduction; electronic packaging; low-temperature sintering; mechanical strength; melting point; nanoparticles; thermal conduction; Lattices; Materials; Nanoparticles; Scanning electron microscopy; Silver; Tin; X-ray scattering; nanoparticles; sintering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105702
Filename :
6105702
Link To Document :
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