DocumentCode
2682970
Title
The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates
Author
Wun, Kai-Lam Bill ; Margaritis, George
Author_Institution
Electron. Assembly Dev. Center, Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1996
fDate
28-31 May 1996
Firstpage
540
Lastpage
545
Abstract
Seven underfill formulations have been evaluated for fast-flow fast-cure and low-clearance flow application for flip chip assembly. The effects of different ingredients are discussed. At least one formulation is found to have superior flow rate under a 30-micron die than any known commercial underfill available so far
Keywords
encapsulation; flip-chip devices; integrated circuit packaging; reflow soldering; 30 micron; direct chip attachment; encapsulation; fast-cure underfills; fast-flow fast-cure process; flip chip; flow rate; low-clearance flow application; organic substrates; underfill formulations; Additives; Assembly; Curing; Epoxy resins; Flip chip; Glass; Milling machines; Moisture; Temperature; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.517441
Filename
517441
Link To Document