DocumentCode :
2683009
Title :
Characterization of Al/Cu/W bond pad micro-corrosion
Author :
Gong, Guo-Liang ; Li, Li ; Liu, Wei ; Song, Mei-Jiang ; Xu, Xue-Song ; Ye, De-Hong ; Yao, Jin-Zhong
Author_Institution :
Freescale Inc., Tianjin, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
234
Lastpage :
238
Abstract :
In this paper, micro-corrosion of Al/Cu/W bond pad was studied. During DI water cleaning process, theta phase Al2Cu and surrounding Al performed well as typical galvanic cell, resulting in pad metal micro-corrosion. DI water with Pb2+ is thought to be outside electrical path of the galvanic cell. It is firmly believed that Pb-contained particles on top of Al2Cu and surrounding Al oxide and/or hydroxide were the cathodic and anodic reaction product respectively.
Keywords :
aluminium alloys; chip scale packaging; copper alloys; corrosion; lead bonding; tungsten alloys; Al-Cu-W; Al2Cu; DI water cleaning process; anodic reaction product; bond pad microcorrosion; cathodic reaction product; galvanic cell; pad metal microcorrosion; theta phase; Cleaning; Copper; Corrosion; Grain boundaries; Lead; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105706
Filename :
6105706
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2683009
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