• DocumentCode
    2683009
  • Title

    Characterization of Al/Cu/W bond pad micro-corrosion

  • Author

    Gong, Guo-Liang ; Li, Li ; Liu, Wei ; Song, Mei-Jiang ; Xu, Xue-Song ; Ye, De-Hong ; Yao, Jin-Zhong

  • Author_Institution
    Freescale Inc., Tianjin, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    234
  • Lastpage
    238
  • Abstract
    In this paper, micro-corrosion of Al/Cu/W bond pad was studied. During DI water cleaning process, theta phase Al2Cu and surrounding Al performed well as typical galvanic cell, resulting in pad metal micro-corrosion. DI water with Pb2+ is thought to be outside electrical path of the galvanic cell. It is firmly believed that Pb-contained particles on top of Al2Cu and surrounding Al oxide and/or hydroxide were the cathodic and anodic reaction product respectively.
  • Keywords
    aluminium alloys; chip scale packaging; copper alloys; corrosion; lead bonding; tungsten alloys; Al-Cu-W; Al2Cu; DI water cleaning process; anodic reaction product; bond pad microcorrosion; cathodic reaction product; galvanic cell; pad metal microcorrosion; theta phase; Cleaning; Copper; Corrosion; Grain boundaries; Lead; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105706
  • Filename
    6105706
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2683009