High performance optoelectronic packaging for 2.5 and 10 Gb/s laser modules

This paper reviews the challenges associated with developing robust and manufacturable designs for laser modules capable of intercity trunking at speeds up to 10 Gb/s. Results from electrical, thermal, and optical simulations are presented and verified experimentally. Trade-off issues resulting from conflicting performance requirements are also discussed. A sensitive technique for measuring submicron mechanical motions is described and applied to a critical subassembly. Finally, a novel optical design is proposed which compensates spherical aberrations while providing greater than 40 dB of optical isolation