Characteristics of a new non-rosin, lead-free solder paste activity system

In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5-Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system,.