DocumentCode
2683228
Title
The reliability model of Micro-electromechanical system based on fracture mechanism
Author
Yang, Chunhua ; Liu, Qin ; Li, Tao
Author_Institution
North Syst. of Eng. Inst., Beijing, China
fYear
2011
fDate
12-15 June 2011
Firstpage
378
Lastpage
382
Abstract
Fracture failure is one of the main failure modes of Micro-electromechanical system (MEMS). Based on studying MEMS´s fracture failure mechanism, the reliability models for MEMS fracture failure under mechanical stress field, electrostatic field, and alternating electric field are built with mechanical reliability methods. The model building process is shown by an application case. These models supply some references to engineers who do reliability design and analysis of MEMS.
Keywords
fracture; micromechanical devices; reliability; MEMS; alternating electric field; electrostatic field; fracture failure mechanism; mechanical stress field; microelectromechanical system; reliability model; Accelerometers; Analytical models; Materials; Micromechanical devices; Reliability; Strain; Stress; MS; eliabilit Model; racture Mechanism;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on
Conference_Location
Guiyang
Print_ISBN
978-1-61284-667-5
Type
conf
DOI
10.1109/ICRMS.2011.5979296
Filename
5979296
Link To Document