Title :
The reliability model of Micro-electromechanical system based on fracture mechanism
Author :
Yang, Chunhua ; Liu, Qin ; Li, Tao
Author_Institution :
North Syst. of Eng. Inst., Beijing, China
Abstract :
Fracture failure is one of the main failure modes of Micro-electromechanical system (MEMS). Based on studying MEMS´s fracture failure mechanism, the reliability models for MEMS fracture failure under mechanical stress field, electrostatic field, and alternating electric field are built with mechanical reliability methods. The model building process is shown by an application case. These models supply some references to engineers who do reliability design and analysis of MEMS.
Keywords :
fracture; micromechanical devices; reliability; MEMS; alternating electric field; electrostatic field; fracture failure mechanism; mechanical stress field; microelectromechanical system; reliability model; Accelerometers; Analytical models; Materials; Micromechanical devices; Reliability; Strain; Stress; MS; eliabilit Model; racture Mechanism;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on
Conference_Location :
Guiyang
Print_ISBN :
978-1-61284-667-5
DOI :
10.1109/ICRMS.2011.5979296
