Reliability assessment of BGA packages

Author

Tan, Geok-Leong ; Hoo, Chuan-Yau ; Chew, Gerard ; Low, Jim-Hee ; Tay, Nam-Beng ; Chakravorty, K.K. ; Lim, Thiam-Beng

Author_Institution

Inst. of Microelectron., Singapore

fYear

1996

fDate

28-31 May 1996

Firstpage

687

Lastpage

693

Abstract

As interest in BGA packaging continues to surge in the industry, many companies are evaluating the package for immediate and future use. Evaluation and acceptance of new packages take time. Furthermore, standards are required to benchmark new packages. This paper presents the results of a reliability assessment exercise on five types of BGA packages. This assessment includes JEDEC moisture sensitivity, temperature cycling, thermal shock, mechanical test, warpage measurement and FEA simulation. Four types of overmolded BGA (different substrates, e.g. 2-layer, 4-layer, metal core) and one glob-top BGA packages were tested

Keywords

deformation; environmental degradation; environmental testing; finite element analysis; integrated circuit packaging; integrated circuit reliability; mechanical testing; moisture; plastic packaging; BGA packages; FEA simulation; JEDEC moisture sensitivity; glob-top packages; mechanical test; overmolded packages; reliability assessment; substrates; temperature cycling; thermal shock; warpage measurement; Acoustic testing; Delamination; Electronics packaging; Microelectronics; Moisture; Plastic integrated circuit packaging; Plastic packaging; Surges; Temperature sensors; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517459

Filename

517459