Effect of Ti on wettability and interface reaction of Sn0.7Cu lead-free solder

Author

Wei, Guoqiang ; Luo, Daojun ; Gao, Hongyong ; He, Guanghui

Author_Institution

South China Univ. of Technol., Guangzhou, China

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

308

Lastpage

312

Abstract

The effect of adding Ti in Sn0.7Cu lead-free solder on the wettability and interfacial reaction between the solder and Cu substrate was investigated. The results show that the wettability can be improved by adding Ti in Sn0.7Cu solder, and the spreading area is increased by 5% compared with that of Sn0.7Cu solder. It is also revealed that the growth rate of the interfacial intermetallic compound (IMC) is compressed and the IMC grain size is increased during soldering reaction. With the increase of soldering time, the IMC morphology evolves gradually from scallop-shaped to serration-shaped, and the IMC which dissolves or fractures into the solder bulk is observed.

Keywords

copper alloys; crystal morphology; dissolving; grain size; soldering; solders; surface chemistry; tin alloys; titanium alloys; wetting; Cu; IMC grain size; IMC growth rate; TiSnCu; dissolving process; fracture process; interface reaction; interfacial intermetallic compound; lead-free solder; scallop-shaped morphology; serration-shaped morphology; soldering reaction; soldering time; spreading area; wettability; Copper; Grain size; Lead; Morphology; Soldering; Substrates; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105723

Filename

6105723