Title :
The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package
Author :
Huang, Yingzhuo ; Lin, Pengrong ; Cao, Yusheng ; Yao, Quanbin
Author_Institution :
Beijing MXTronics Corp. Beijing, Beijing, China
Abstract :
Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.
Keywords :
ball grid arrays; ceramic packaging; lead alloys; reliability; solders; tin alloys; CBGA; CCGA package; PCB assembly; SnPb; board-level reliability; ceramic ball grid array packages; ceramic column grid array packages; column-to-component pads; high-density interconnections; high-temperature solder columns; package solder joint; palladium addition; palladium-tin intermetallics; printed circuit board assembly; thermal fatigue life; Arrays; Intermetallic; Joints; Packaging; Palladium; Reliability; Surface morphology;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105728
