DocumentCode
2683504
Title
Enhanced PBGA-the next generation
Author
Carichner, Karla ; Dandia, Sanjay
Author_Institution
LSI Logic Corp., Fremont, CA, USA
fYear
1996
fDate
28-31 May 1996
Firstpage
702
Lastpage
706
Abstract
This paper describes LSI Logic´s new generation of Enhanced Plastic Ball Grid Array (EPBGA) package designs. The first generation was developed and implemented into production. As its popularity grew, new performance requirements emerged. The second generation was designed with enhancements to meet these new requirements. This paper describes the first generation to give the reader sufficient background information, and proceeds to discuss the enhancements of the second generation, including their implementation, and their effect on the manufacturability and reliability of the package family
Keywords
integrated circuit packaging; integrated circuit reliability; microassembling; plastic packaging; LSI Logic; ball grid array package; enhanced PBGA; enhanced plastic BGA package; manufacturability; reliability; Bonding; Copper; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Large scale integration; Logic arrays; Logic design; Variable structure systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.517461
Filename
517461
Link To Document