DocumentCode :
2683744
Title :
Weld technology reliability analysis of cathode in vacuum tube
Author :
Song, Fang Fang ; Feng, Xian-long ; Li, Sha Jin ; Yu, Shiji
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
414
Lastpage :
417
Abstract :
Influence of weld technology on reliability and life to cathode in vacuum tube was studied by requests of microwave tube. The quality of weld technology quite affects the emission capability of cathode. The mode of weld quite affects thermal efficiency of cathode in vacuum tube. Thermal efficiency of cathode can increase availably by changing the weld technology on the heat transfer path. Thermal analysis and optimization design of cathode module for vacuum tube was carried out with the FEM in order to obtain required cathode temperature with lower heat power. The weld mode quite affects the cathode heat power, for example, the cathode heat power can reduce 28.6% with 8+8 laser spot welding. We have also built the life test system of TWT´s electron gun structure of 8+8 laser spot welding, using this life test system, up to 30 years life of cathode is forecasted.
Keywords :
cathodes; electron guns; finite element analysis; heat transfer; laser beam welding; life testing; microwave tubes; reliability; spot welding; thermal analysis; travelling wave tubes; vacuum tubes; welds; FEM; TWT electron gun structure; cathode heat power; cathode module; cathode temperature; emission capability; heat transfer path; laser spot welding; life test system; microwave tube; optimization design; thermal analysis; thermal efficiency; vacuum tube; weld mode; weld technology reliability analysis; Cathodes; Electron tubes; Reliability; Resistance heating; Thermal analysis; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105743
Filename :
6105743
Link To Document :
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