Title :
Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED
Author :
Wang, Ling ; Wang, Hongqin ; Wan, Chao ; Wang, Pengcheng ; Li, Mingyu ; Du, Bin ; Deng, Meiling ; He, Lijiao
Author_Institution :
State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., Shenzhen, China
Abstract :
The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.
Keywords :
conductive adhesives; curing; light emitting diodes; resins; shear strength; thermal conductivity; thermal stability; LED application; dicyandiamide resin; isotropy conductive adhesive; lap shear strength; latent curing agent; methylhexahydrophthalic anhydride; phenolic resin; thermal stability; volume resistivity; Conductive adhesives; Conductivity; Curing; Light emitting diodes; Materials; Packaging; Thermal stability; LED application; curing agent; isotropy conductive adhesives; reliabillity;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105750
