Title :
A new package structure with power stacked-die multi-row lead and process flow
Author :
Qiu, Shunan ; Zong, Fei ; Jiang, Tian
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead trimming and forming processes. This paper will also analyze the potential issues of manufacturing process and propose the corresponding solutions.
Keywords :
dies (machine tools); electronics packaging; forming processes; lead bonding; system-in-package; Al wire; die bonding; forming process; high I/O count; lead trimming; manufacturing process flow; molding; multirow lead; package structure; power capability; power stacked-die; semiconductor packaging; system in package; wire bonding; Bonding; Compounds; Copper; Lead; Materials; Microassembly; Wires;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105755
