DocumentCode :
2684012
Title :
Effect of gate bias on ESD characteristics in NMOS device
Author :
He, Yujuan ; En, Yunfei ; Luo, Hongwei ; Xiao, Qingzhong
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electr. Component Lab., Guangzhou, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
360
Lastpage :
362
Abstract :
Oxide trapped charges which were produced in oxide area of MOSFET in the process of using can cause ESD characteristic changed. So the gate forced given bias to Simulate oxide trapped charges. In this paper, TLP test method was used to study the ESD parameters of NMOSFET with various gate biases. It was indicated that the threshold voltage Vt1 and secondary breakdown current It2 first increased and then decreased with the gate voltage increasing, but the maintained Voltage Vsp essentially unchanged.
Keywords :
MOS integrated circuits; MOSFET; electrostatic discharge; ESD characteristics; NMOS device; NMOSFET; TLP test method; gate bias; oxide trapped charges; Breakdown voltage; Electrostatic discharges; Logic gates; MOSFET circuits; Materials; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105756
Filename :
6105756
Link To Document :
بازگشت