Abstract :
The following topics are dealt with: nano-functional materials, nano devices and emerging materials; advanced packages and interconnections; and underfill, adhesives and high density substrates/board.
Keywords :
adhesives; electronics packaging; nanotechnology; substrates; adhesives; advanced package; advanced packaging materials; emerging materials; high density substrates/board; interconnections; nanodevices; nanofunctional materials; underfill;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105758
