Title :
Design and development of a high performance PBGA package for the UltraSPARC-ITM processor
Author :
Abbott, John ; Hamilton, Gerald ; Kalidas, Navin ; Murtuza, Masood ; Thornton, Chris ; Thomas, Sunil ; Umeda, Yoshikatsu ; Malladi, Deviprasad ; Towne, Dave ; Chao, Shun-lung
Author_Institution :
Texas Instrum. Inc., Stafford, TX, USA
Abstract :
This paper describes the development of a 520 terminal Plastic Ball Grid Array (PBGA) package to meet the system level requirements of the UltraSPARC-ITM microprocessor. The Printed Circuit Board (PCB) substrate PBGA package developed was designed to handle chip operation above 200 MHz and dissipate 36 watts of power with the assistance of an integral heat sink and airflow. Mechanical stresses, board level reliability, thermal and electrical requirements are outlined. The package enhancements and process refinements executed to meet the design goals and reliability requirements are presented
Keywords :
heat sinks; integrated circuit packaging; integrated circuit reliability; lead bonding; microassembling; microprocessor chips; plastic packaging; 200 MHz; 36 W; PCB substrate; UltraSPARC-I processor; airflow; board level reliability; electrical requirements; high performance PBGA package; integral heat sink; mechanical stresses; microprocessor; plastic BGA package; plastic ball grid array; system level requirements; thermal requirements; Central Processing Unit; Electronic packaging thermal management; Electronics packaging; Heat sinks; Instruments; Microprocessors; Power dissipation; Stress; Sun; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517464
