Embedded Passives On Multi-Layer Printed Circuit Board for 5GHz WLAN Power Amplifier

This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.