Title :
Designing circuits and processes to optimize performance and reliability: metallurgy meets TCAD
Author :
Thompson, C.V. ; Knowlton, B.D.
Author_Institution :
Massachusetts Institute of Technology
Keywords :
Current density; Design optimization; Electromigration; Grain size; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Materials science and technology; Process design; Temperature;
Conference_Titel :
Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
Print_ISBN :
0-7803-3369-1
DOI :
10.1109/ESREF.1996.888192
