• DocumentCode
    2684676
  • Title

    Designing circuits and processes to optimize performance and reliability: metallurgy meets TCAD

  • Author

    Thompson, C.V. ; Knowlton, B.D.

  • Author_Institution
    Massachusetts Institute of Technology
  • fYear
    1996
  • fDate
    1996
  • Firstpage
    1683
  • Lastpage
    1690
  • Keywords
    Current density; Design optimization; Electromigration; Grain size; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Materials science and technology; Process design; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on
  • Print_ISBN
    0-7803-3369-1
  • Type

    conf

  • DOI
    10.1109/ESREF.1996.888192
  • Filename
    888192
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2684676